Capabilities

 Resources

DEC relies on its own, in-house resources and is not dependent on third party operations. Our assets include the latest technology in pick and place, solder, reflow, wave solder, rework, inspection, prepping, finishing, and programing equipment, which can handle the most complex layouts.

 Assembly Capabilities

At DEC we understand the need for quick turnaround. We pride ourselves in providing exceptional Quality and Customer Service to meet or exceed all of your electronic assembly requirements.

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    Quantity

    High mix prototype, low to mid volume, and higher volumes on scheduled delivery

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    Types of Assembly

    SMT, Thru-Hole, Press-fit, and Mixed Technology Assembly of Printed Circuit Boards.

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    Other Assembly Services

    Electro Mechanical Assembly, Cabling and Wiring, Box Build, BGA Rework, and Board Rework

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    Solder Type

    Lead and Lead Free Solder

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    Solder Process

    Reflow, Hand, Selective, Wave, Dip, and Hot Bar

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    Components

    Machine placement down to 01005 size, BGA/CSP to .3mm pitch

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    Component Preparation

    Reel, Tube, Tray, Cut Strip, and Loose

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    Special Inspection

    100% multi-step inspection on all assemblies irrespective of quantity, X-ray 100% on all bottom contact parts, and AOI

 Turn Times

Quick Turn - 1 to 7 days
Standard - 10 days
Scheduled - Tailored delivery for higher volumes

 

DEC, LCC
1790 E. McFadden Avenue, Suite 105
Santa Ana, CA 92705

 

Phone: 714-550-1197
Fax: 714-550-1087

DYNASTY ELECTRONIC COMPANY, LLC