Capabilities
Resources
DEC relies on its own, in-house resources and is not dependent on third party operations. Our assets include the latest technology in pick and place, solder, reflow, wave solder, rework, inspection, prepping, finishing, and programing equipment, which can handle the most complex layouts.
Turn Times
Quick Turn - 1 to 7 days
Standard - 10 days
Scheduled - Tailored delivery for higher volumes
Assembly Capabilities
At DEC we understand the need for quick turnaround. We pride ourselves in providing exceptional Quality and Customer Service to meet or exceed all of your electronic assembly requirements.
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Quantity
High mix prototype, low to mid volume, and higher volumes on scheduled delivery
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Types of Assembly
SMT, Thru-Hole, Press-fit, and Mixed Technology Assembly of Printed Circuit Boards.
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Other Assembly Services
Electro Mechanical Assembly, Cabling and Wiring, Box Build, BGA Rework, Board Rework, and BGA Reballing
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Solder Type
Sn Pb (Tin-lead) and RoHs (Lead Free) Solder, Resin and Rosin Flux
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Solder Process
Reflow, Hand, Selective, Wave, Dip, and Hot Bar
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Components
Machine placement down to 01005 size, BGA/CSP to 0.3mm pitch
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Component Preparation
Reel, Tube, Tray, Cut Strip, and Loose
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Special Inspection
100% multi-step inspection on all assemblies irrespective of quantity, X-ray 100% on all bottom contact parts, SPI, and AOI